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2023-07-17 09:48 | Report Abuse
Globetronics 26th AGM Minutes:
Question 3: Position of the company in AI trend.
Answer : With the adoption of advanced packaging where we have with a wafer level packaging, non-wire bonded package, flip chip bga and wafer-level CFB package ,we are definitely in a good position to be able to eventually benefit in this trend.
2023-06-07 08:15 | Report Abuse
Globetronics’ new platform is set to gear up for exciting next generation semiconductor wafer-level packaging technology including the 2.5D, where the stacking of dies will be replaced by flip-chip on a silicon interposer.
Source: MIDA
Photo credit: The Edge
CoWoS is a 2.5D wafer-level multi-chip packaging technology that incorporates multiple dies side-by-side on a silicon interposer in order to... by TSMC
2023-06-07 08:12 | Report Abuse
搶市占!台積電CoWoS封裝產能供不應求
AI伺服器訂單三級跳,台積電先進CoWoS封裝產能嚴重供不應求,台積電總裁魏哲家6日表示,去年起,CoWoS需求幾乎是雙倍成長,明年需求持續強勁。
“Because of ChatGPT, TSMC has received large orders for advanced packaging. Demand has greatly exceeded our capacity,” Liu said.
Nvidia Corp, a major supplier of AI graphics processing units, is one of the major clients of TSMC’s chip-on-wafer-on-substrate (CoWoS) packaging technology.
To satisfy customers’ demand, TSMC allocated some capacity for the advanced packaging technology at its fab in Taoyuan’s Longtan District (龍潭), Liu said, adding that it outsources some of the CoWoS production to chip packagers.
For the full year, CoWoS capacity would be double the size of last year, as the company continues its pace of expansion, he said.
Stock: [GTRONIC]: GLOBETRONICS TECHNOLOGY BHD
2023-07-17 09:48 | Report Abuse
“Because of ChatGPT, TSMC has received large orders for advanced packaging. Demand has greatly exceeded our capacity,” Liu said.
Nvidia Corp, a major supplier of AI graphics processing units, is one of the major clients of TSMC’s chip-on-wafer-on-substrate (CoWoS) packaging technology.
To satisfy customers’ demand, TSMC allocated some capacity for the advanced packaging technology at its fab in Taoyuan’s Longtan District (龍潭), Liu said, adding that it outsources some of the CoWoS production to chip packagers.
For the full year, CoWoS capacity would be double the size of last year, as the company continues its pace of expansion, he said.